Electrolytic Nickel
|
|
Nickel Square
1"x1"
Specification
|
| Content |
Origin |
Application |
Packing |
|
99.98% Nickel |
Norway
|
Nickel
Square contains high purity of nickel. It is used for plating on
metalware, bicycles, battery casting, stationery and others
|
250kg x4 drums/pallet
10kg x100 bags/wooden box |
|
| |
|
Nickel Square
2"x2" & Nickel Cathode (untrimmed)
Specification
|
| Content |
Origin |
Application |
Packing |
|
99.98% Nickel |
Norway
|
Nickel
Square contains high purity of nickel. It is used for plating on
metalware, bicycles, battery casting, stationery and others
|
250kg x4 drums/pallet |
|
| |
|
Nickel Crown
Specification
|
| Content |
Origin |
Application |
Packing |
|
99.98% Nickel |
Norway
|
Nickel Crown
shape provides smooth-flowing, easy handling properties, good
dissolution and promotes good settling in anode basket, so
important in preventing void formation and cost saving |
10kg x100 bags/wooden box |
|
| |
|
Nickel D-Crown
Specification
|
| Content |
Origin |
Application |
Packing |
99.95% Nickel
(with Sulphur 0.02%) |
Norway
|
Nickel D-Crown is a
sulphur-depolarized form of high purity, electrolytic nickel
crown. It is used for electroplating and electroforming |
10kg x100 bags/wooden box |
|
|
|
Electrolytic Cobalt
|
|
Specification
|
| Content |
Origin |
Application |
Packing |
|
>99.95%
Cobalt |
Norway
|
For
superalloys and heat resistance, durable alloys & tool steels |
250kg x4 drums/pallet |
|
|
Copper Anode
|
|
Oxygen Free Copper
Nugget 1"x1"
Specification
|
| Content |
Origin |
Application |
Packing |
|
>99.95%
Copper |
U.S.A.
|
For
electroplating of copper on semiconductors, printed circuit
boards, and plastic |
100kg x9 drums/pallet |
|
| |
|
Phosphorous
Copper Ball 25 mm
Specification
|
| Content |
Origin |
Application |
Packing |
|
>99.96%
Copper |
U.S.A.
|
For
electroplating of copper on semiconductors, printed circuit
boards, and plastic |
100kg x9 drums/pallet |
|
| |
|
Phosphorous
Copper Quadstar Bar 1 3/4"x3"x22" mm
Specification
|
| Content |
Origin |
Application |
Packing |
|
>99.96%
Copper |
U.S.A.
|
For
electroplating of copper on semiconductors, printed circuit
boards, and plastic |
Approx 50x16kg/bundle |
|
| |
|
